Memory repair system and method

ABSTRACT

A memory system includes an array of memory cells. The array of memory cells includes redundant memory cells. The redundant memory cells include at least two of a redundant row and a redundant column of memory cells. The repair module is configured to (i) identify at least two of a row and a column of the array of memory cells having non-operational memory cells and (ii) substitute the at least two of the row and the column of the array of memory cells with selected rows or columns of the redundant memory cells based on X predetermined sequences of substitutions. The repair module is configured to detect a failure in the array of memory cells that cannot be repaired using the X predetermined sequences of substitutions, and use an alternative repair sequence to repair the non-operational memory cells based on the detection of the failure.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.11/869,308 filed on Oct. 9, 2007, which claims the benefit of U.S.Provisional Application No. 60/829,072, filed on Oct. 11, 2006. Thedisclosures of the above applications are incorporated herein byreference in their entirety.

FIELD

The present disclosure relates to memory devices, and more particularlyto repairing memory locations within memory devices.

BACKGROUND

The background description provided herein is for the purpose ofgenerally presenting the context of the disclosure. Work of thepresently named inventors, to the extent the work is described in thisbackground section, as well as aspects of the description that may nototherwise qualify as prior art at the time of filing, are neitherexpressly nor impliedly admitted as prior art against the presentdisclosure.

Semiconductor memory devices, such as random access memory (RAM),dynamic random access memory (DRAM), static random access memory (SRAM),read only memory (ROM), programmable read only memory (PROM),electrically programmable read only memory (EPROM), electricallyerasable programmable read only memory (EEPROM), and/or flash memory,include an integrated circuit (IC) that stores data and/or code. Incertain applications, loss of any of the data may require a manufacturerand/or end user to replace the memory, which may be costly.

Referring now to FIG. 1, a memory control module 10 may controlread/write operations to memory 14. The memory 14 includes memory banks42-1, 42-2, . . . , and 42-x (collectively referred to as memory banks42). Each memory bank 42 includes address rows 44-1, 44-2, . . . , and44-y, referred to collectively as address rows 44, and address columns46-1, 46-2, . . . , and 46-z (collectively referred to as addresscolumns 46). Data bits are stored in the memory 14 according to specificaddress rows 44 and address columns 46 in each memory bank 42. Variousmethods are used to correct defects and improve memory yield. One methodincludes adding redundant address locations to the memory 14.

Referring now to FIGS. 2A and 2B, a memory repair device 64 may correctdefects in the memory 14. The memory repair device 64 may be internal orexternal to a system that includes the memory 14. The memory repair 64device may be implemented in a built-in self-test (BIST) that mayinclude hardware or automatic test equipment (ATE) that may includesoftware. The memory repair device 64 may command a memory repairsub-circuit 65 that may substitute redundant rows and/or columns of thememory 14 for defective address rows and/or columns.

The memory 14 includes memory banks 42, address rows 44, and addresscolumns 46. Each memory bank 42 includes redundant address rows 58-1,58-2, . . . , and 58-m (referred to collectively as redundant addressrows 58), and/or redundant address columns 60-1, 60-2, . . . , and 60-n(referred to collectively as redundant address columns 60).Alternatively, the memory 14 may include redundant memory banks that maybe substituted for defective banks.

Initially, the bit locations provided by the redundant address rows 58and address columns 60 are not associated with a particular memoryaddress. The memory repair sub-circuit 65 programs the redundant addressrows 58 and address columns 60 to correspond to a specific memoryaddress when a bit location associated with a memory address is found tobe defective. The memory repair sub-circuit 65 may use hard repair orsoft repair operations. Both hard and soft repair operations result in aredundant memory portion being used to store the data that would haveotherwise been stored in the defective memory portion. Basically, thedefective memory portion is remapped to the redundant memory portioneither reversibly with a soft repair operation or irreversibly with ahard repair operation.

For a hard repair operation, the memory repair sub-circuit 65 mayinclude fuses 63-1, 63-2, . . . , and 63-a, referred to collectively asfuses 63 (e.g. laser fuses and/or electrical fuses). The memory repairdevice 64 is connected to the memory repair sub-circuit 65 to determinea defective bit location associated with a memory address. The memoryrepair device 64 blows one or more of the fuses 63 (i.e. applies a laseror electrical current to the fuses 63) to form a new data path to theredundant location. Thereafter, data that is directed to be stored atthe memory address may be stored in the redundant location. In thismanner, an originally defective memory device may be repaired and alsomay be suitable to be used and/or sold.

In FIG. 2B, an exemplary memory repair sub-circuit 65 is shown infurther detail. Signals 66-1, 66-2, . . . , and 66-b, referred tocollectively as signals 66, are indicative of memory addresses ofdefective memory locations. For example, the signals 66 may beindicative of a defective address row. The memory repair sub-circuit 65receives the signals 66 and a repair signal 67 from the memory repairdevice 64. The signals 66 are input to a redundant row decoder 68. Theredundant row decoder 68 communicates with a redundant row 58-1according to statuses of the fuses 63. As described above, the memoryrepair device 64 may be used to blow one or more of the fuses 63 toprogram the redundant row decoder 68 to associate a particular memoryaddress with the redundant row 58-1. A similar approach may be used forredundant columns.

As mentioned, the above-described memory hard repair operation resultsin a permanent re-association of the memory address with the redundantlocation. The memory repair operation permanently changes the electricalbehavior of the fuse element. In the case of a laser fuse, a high energylaser beam cuts through the fuse (i.e. a conductive fuse element isrendered non-conductive as a result of the memory repair operation). Inthe case of an electrical fuse, an electric pulse or pulses are appliedto the fuse element. As a result, the fuse element changes fromconductive to non-conductive or from non-conductive to conductive. Ahard repair is performed once during manufacturing test, and ispermanent for the lifetime of the memory.

For a soft repair, the memory repair device 64 remaps data paths bystoring values in a remapping register of the memory repair sub-circuit65 so that data is stored in memory 14 according to the remappingregister. For example, the remapping register causes certain logic gatesto be turned on and other logic gates to be turned off similar toblowing fuses in the hard repair operation. The registers, however, maybe reset; and soft repairs may not permanently alter data paths to thememory 14.

SUMMARY

A memory system is provided and includes an array of memory cells and arepair module. The array of memory cells includes redundant memorycells. The redundant memory cells include at least two of (i) aredundant row of memory cells and (ii) a redundant column of memorycells. The repair module is configured to (i) identify at least two of arow and a column of the array of memory cells having non-operationalmemory cells and (ii) substitute the at least two of the row and thecolumn of the array of memory cells having non-operational memory cellswith selected rows or columns of the redundant memory cells based on Xpredetermined sequences of substitutions, where X is an integer greaterthan 1. The repair module is configured to detect a failure in the arrayof memory cells that cannot be repaired using the X predeterminedsequences of substitutions, and use an alternative repair sequence torepair the non-operational memory cells based on the detection of thefailure.

In other features, a self-repairing memory system includes memoryincluding memory elements and redundant memory elements. The memoryelements include a plurality of memory cells. A memory repair moduleidentifies non-operational memory cells and selects at least one memoryelement including the non-operational memory cells. A first repairsub-circuit soft repairs the memory by substituting the selected memoryelements with the redundant memory elements. A second repair sub-circuithard repairs the memory based on the substitutions.

In other features, the second repair sub-circuit hard repairs the memorywhen substantially all of the non-operational memory cells identified bythe memory repair module are repaired by the substitutions. The firstmemory repair sub-circuit includes registers, and the second memoryrepair sub-circuit includes at least one of fuses and anti-fuses. Atleast one of the first memory repair sub-circuit, the second memoryrepair sub-circuit, the memory repair module, and the memory controlmodule is integrated with the memory in an integrated circuit. Thememory repair module selects one of the memory elements for a respectiveone of the non-operational memory cells from a group consisting of atleast two of a row, a column, a block, and a bank.

In other features, the memory repair module includes a built-in systemtest (BIST) module. The memory repair module tests the redundantelements for failures prior to the soft repairs. Prior to the hardrepairs, at least one of the redundant elements is used to store datathat implements at least one of the soft repairs. The at least oneredundant element stores data that is used to implement the soft repairsduring boot-up of the memory. The memory repair module selects one ofthe memory elements for each of the non-operational memory cells from agroup consisting of a row, a column, a block, and a bank based on afirst predetermined combination.

In other features, the first predetermined combination includesselecting two rows and two columns of the redundant memory elements toreplace two rows and two columns of the memory elements. The memoryrepair module selects a second predetermined combination when the firstpredetermined combination fails to repair the non-operational memorycells. When the second predetermined combination is selected, the memoryrepair module does not retain repair data of prior substitutionsrelating to the first predetermined combination.

In other features, a memory system includes memory including memoryelements and redundant memory elements. The memory elements include aplurality of memory cells. A memory repair module identifiesnon-operational memory cells and selects at least one memory elementincluding the non-operational memory cells based on X differentcombinations of substitutions. The memory repair module substitutes oneof the redundant elements for one of the selected memory elements foreach of the substitutions. The memory repair module determines that oneof the X different combinations of substitutions repairs the memory. Xis a number greater than 1.

In other features, a first memory repair sub-circuit soft repairs thememory based on the substitutions. A second memory repair sub-circuithard repairs the memory based on one of the X different combinations.The first memory repair sub-circuit includes a plurality of registers,and the second memory repair sub-circuit includes at least one of aplurality of fuses and a plurality of anti-fuses. The first and secondmemory repair sub-circuits are integrated with the memory in anintegrated circuit.

In other features, the memory repair module selects one of the memoryelements for a respective one of the non-operational memory cells from agroup consisting of at least two of a row, a column, a block, and abank. The memory repair module includes a built-in system test (BIST).The memory repair module tests one of the redundant elements forfailures prior to the substitutions. The memory repair modulesubstitutes the selected memory elements with one of the redundantmemory elements for each of the substitutions until the memory repairmodule determines that the X different combinations fail to repair thememory.

In other features, the memory repair module tests the memory accordingto each of the X different combinations successively. For eachsuccessive one of the X different combinations, the memory repair moduledoes not retain data of prior substitutions of the redundant memoryelements. The memory repair module substitutes the one of the redundantelements for the one of the selected memory elements for each of thesubstitutions until the memory repair module determines that one of theX different combinations of substitutions repairs the memory.

In other features, a method for self-repairing a memory system includesidentifying non-operational memory cells of memory elements. Memoryincludes the memory elements and redundant memory elements. The memoryelements include a plurality of memory cells including thenon-operational cells. The method also includes selecting at least onememory element including the non-operational memory cells. The methodalso includes soft-repairing the memory by substituting the selectedmemory elements with the redundant memory elements. The method alsoincludes hard-repairing the memory based on the substitutions.

In other features, the method includes hard-repairing the memory whensubstantially all of the non-operational memory cells identified by thememory repair module are repaired by the substitutions. The method alsoincludes hard-repairing the memory by operating at least one of fusesand anti-fuses. The method also includes selecting one of the memoryelements for a respective one of the non-operational memory cells from agroup consisting of at least two of a row, a column, a block, and abank. The method also includes testing the redundant elements forfailures prior to the soft-repairing. The method also includes storingdata that implements at least one of the soft repairs in at least one ofthe redundant elements.

In other features, the method includes storing data that is used toimplement the soft-repairing during boot-up of the memory. The methodalso includes selecting one of the memory elements for each of thenon-operational memory cells from a group consisting of a row, a column,a block, and a bank based on a first predetermined combination. Thefirst predetermined combination includes selecting two rows and twocolumns of the redundant memory elements to replace two rows and twocolumns of the memory elements. The method also includes selecting asecond predetermined combination when the first predeterminedcombination fails to repair the non-operational memory cells.

In other features, a method includes identifying non-operational memorycells. The method also includes selecting at least one memory elementincluding the non-operational memory cells based on X differentcombinations of substitutions. The method also includes substituting oneof a plurality of redundant elements for one of the selected memoryelements for each of the substitutions. The method also includesdetermining that one of the X different combinations of substitutionsrepairs the memory. X is a number greater than 1.

In other features, the method includes soft-repairing the memory basedon the substitutions. The method also includes hard-repairing the memorybased on the one of the X different combinations. The memory elementsare selected from a group consisting of at least two of a row, a column,a block, and a bank. The method also includes testing one of theredundant elements for failures prior to the substitutions. The methodalso includes substituting the selected memory elements with one of theredundant memory elements for each of the substitutions until the Xdifferent combinations fail to repair the memory. The method alsoincludes testing the memory according to each of the X differentcombinations successively.

In other features, the method includes substituting one of the redundantelements for the one of the selected memory elements for each of thesubstitutions. The substitutions continue until determining that one ofthe X different combinations of substitutions repairs the memory.

In other features, a self-repairing memory system includes storage meansfor storing data including memory elements and redundant memoryelements. The memory elements include a plurality of memory cells. Thesystem also includes memory repair means for identifying non-operationalmemory cells and for selecting at least one memory element including thenon-operational memory cells. The system also includes first repairmeans for soft-repairing the memory by substituting the selected memoryelements with the redundant memory elements. The system also includessecond repair means for hard-repairing the memory based on thesubstitutions.

In other features, the second repair means hard repairs the memory whensubstantially all of the non-operational memory cells identified by thememory repair means are repaired by the substitutions. The first memoryrepair means includes registers and the second memory repair meansincludes at least one of fuses and anti-fuses. The memory repair meansselects one of the memory elements for a respective one of thenon-operational memory cells from a group consisting of at least two ofa row, a column, a block, and a bank. The memory repair means includes abuilt-in system test (BIST).

In other features, the memory repair means tests the redundant elementsfor failures prior to the soft repairs. Prior to the hard repairs, atleast one of the redundant elements is used to store data thatimplements at least one of the soft repairs. At least one redundantelement stores data that is used to implement the soft repairs duringboot-up of the storage means. The memory repair means selects one of thememory elements for each of the non-operational memory cells from agroup consisting of a row, a column, a block, and a bank based on afirst predetermined combination. The first predetermined combinationincludes selecting two rows and two columns of the redundant memoryelements to replace two rows and two columns of the memory elements.

In other features, the memory repair means selects a secondpredetermined combination when the first predetermined combination failsto repair the non-operational memory cells. When the secondpredetermined combination is selected, the memory repair means does notretain repair data of prior substitutions relating to the firstpredetermined combination.

In other features, a memory system includes storage means for storingdata including memory elements and redundant memory element. The memoryelements include a plurality of cells. The system also includes memoryrepair means for identifying non-operational memory cells and forselecting at least one memory element including the non-operationalmemory cells based on X different combinations of substitutions. Thememory repair means substitutes one of the redundant elements for one ofthe selected memory elements for each of the substitutions. The memoryrepair means determines that one of the X different combinations ofsubstitutions repairs the memory. X is a number greater than 1.

In other features, a memory system includes first memory repair meansfor soft-repairing the storage means based on the substitutions. Thesystem also includes second memory repair means for hard-repairing thestorage means based on the one of the X different combinations. Thefirst memory repair means includes a plurality of registers and thesecond memory repair means includes at least one of a plurality of fusesand a plurality of anti-fuses. The memory repair means selects one ofthe memory elements for a respective one of the non-operational memorycells from a group consisting of at least two of a row, a column, ablock, and a bank.

In other features, the memory repair means includes a built-in systemtest (BIST). The memory repair means tests one of the redundant elementsfor failures prior to the substitutions. The memory repair meanssubstitutes the selected memory elements with one of the redundantmemory elements for each of the substitutions until the memory repairmeans determines that the X different combinations fail to repair thememory. The memory repair means tests the memory according to each ofthe X different combinations successively.

In other features, for each successive one of the X differentcombinations, the memory repair means does not retain data of priorsubstitutions of the redundant memory elements. The memory repair meanssubstitutes one of the redundant elements for one of the selected memoryelements for each of the substitutions. The substitutions are continueduntil the memory repair means determines that one of the X differentcombinations of substitutions repairs the storage means.

In other features, a self-repairing memory system includes memoryincluding memory elements and redundant memory elements. The memoryelements include a plurality of memory cells. A memory repair moduleidentifies faulty memory cells and selects at least one memory elementincluding the faulty memory cells. A repair sub-circuit includesreversibly programmable circuits that repair the memory by substitutingthe at least one memory element with the redundant memory elements.

In other features, the memory repair module selects one of the memoryelements for each of the faulty memory cells from a group consisting ofa row, a column, a block, and a bank based on a first predeterminedcombination. The first predetermined combination includes selecting tworows and two columns of the redundant memory elements to replace tworows and two columns of the memory elements.

In other features, the memory repair module selects a secondpredetermined combination when the first predetermined combination failsto repair the faulty memory cells. When the second predeterminedcombination is selected, the memory repair module does not retain repairdata of prior substitutions relating to the first predeterminedcombination. The memory repair module cycles through a plurality ofpredetermined combinations to repair the faulty memory cells. The repairsub-circuit repairs the memory when substantially all of the faultymemory cells identified by the memory repair module are repaired by thesubstitutions.

In other features, the memory repair sub-circuit includes reversiblefuses. The reversible fuses include flash based fuse circuits. Thememory repair module selects one of the memory elements for a respectiveone of the faulty memory cells from a group consisting of at least twoof a row, a column, a block, and a bank. The memory repair modulecomprises a built-in system test (BIST) module.

In other features, a self-repairing memory system includes means forstoring data including memory elements and redundant memory elements.The memory elements include a plurality of memory cells. The system alsoincludes memory repair means for identifying faulty memory cells andselecting at least one memory element including the faulty memory cells.Repair sub-means are included for reversibly programming circuits thatrepair the means for storing data by substituting at least one memoryelement with the redundant memory elements.

In other features, the memory repair means selects one of the memoryelements for each of the faulty memory cells from a group consisting ofa row, a column, a block, and a bank based on a first predeterminedcombination. The first predetermined combination includes selecting tworows and two columns of the redundant memory elements to replace tworows and two columns of the memory elements.

In other features, the memory repair means selects a secondpredetermined combination when the first predetermined combination failsto repair the faulty memory cells. When the second predeterminedcombination is selected, the memory repair means does not retain repairdata of prior substitutions relating to the first predeterminedcombination. The memory repair means cycles through a plurality ofpredetermined combinations to repair the faulty memory cells. The repairsub-means repairs the means for storing data when substantially all ofthe faulty memory cells identified by the memory repair means arerepaired by the substitutions.

In other features, the memory repair sub-means includes reversiblefuses. The reversible fuses include flash based fuse circuits. Thememory repair means selects one of the memory elements for a respectiveone of the faulty memory cells from a group consisting of at least twoof a row, a column, a block, and a bank. The memory repair meanscomprises built-in system test (BIST) means for testing a system.

Further areas of applicability of the present disclosure will becomeapparent from the detailed description provided hereinafter. It shouldbe understood that the detailed description and specific examples, whileindicating the preferred embodiment of the disclosure, are intended forpurposes of illustration only and are not intended to limit the scope ofthe disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure will become more fully understood from thedetailed description and the accompanying drawings, wherein:

FIG. 1 is a functional block diagram of an exemplary memory systemaccording to the prior art;

FIG. 2A is a functional block diagram of a memory that includesredundant rows and columns according to the prior art;

FIG. 2B is a functional block diagram of a redundant memory circuit thatincludes fuses according to the prior art;

FIG. 3 is a functional block diagram of a memory repair system accordingto the present disclosure;

FIG. 4 is a functional block diagram of a memory repair module accordingto the present disclosure;

FIG. 5 is a chart that illustrates a method for operating the memoryrepair system according to the present disclosure;

FIGS. 6A-6L are functional block diagrams of exemplary memory accordingto the present disclosure;

FIG. 7 is a flow diagram that illustrates steps for operating a memoryrepair module according to the present disclosure;

FIG. 8A is a flow diagram that illustrates steps of a memory repairmethod according to an embodiment of the present disclosure;

FIG. 8B is a flow diagram that illustrates steps of a memory repairmethod according to another embodiment of the present disclosure

FIG. 9A is a functional block diagram of a hard disk drive;

FIG. 9B is a functional block diagram of a DVD drive;

FIG. 9C is a functional block diagram of a high definition television;

FIG. 9D is a functional block diagram of a vehicle control system;

FIG. 9E is a functional block diagram of a cellular phone;

FIG. 9F is a functional block diagram of a set top box; and

FIG. 9G is a functional block diagram of a mobile device.

DETAILED DESCRIPTION

The following description is merely exemplary in nature and is in no wayintended to limit the disclosure, its application, or uses. For purposesof clarity, the same reference numbers will be used in the drawings toidentify similar elements. As used herein, the phrase at least one of A,B, and C should be construed to mean a logical (A or B or C), using anon-exclusive logical or. It should be understood that steps within amethod may be executed in different order without altering theprinciples of the present disclosure.

As used herein, the term module refers to an Application SpecificIntegrated Circuit (ASIC), an electronic circuit, a processor (shared,dedicated, or group) and memory that execute one or more software orfirmware programs, a combinational logic circuit, and/or other suitablecomponents that provide the described functionality.

According to the present disclosure, memory includes redundant andnon-redundant data storage/memory elements. The data storage elementsmay be cells, rows, columns, banks, and/or blocks of the memory. Amemory control module may detect defects in the memory and trigger amemory repair operation. A memory repair module may test the memory anddetermine what repairs, if any, will repair the memory.

The memory repair module may be a modified built-in system test (BIST)that repairs memory via an on-the-fly process that includes both softand hard repair operations. When a failure occurs in a read/write fromthe memory, the memory repair module may respond as if the failed cellor cells are defective. The memory repair module may remap the memorybased on one or more different repair combinations that may be sets ofsequences of repair operations.

Each of the repair operation sequences may include the same number ofpredetermined repair operations that may relate to the number ofredundant elements. Each of the repair operations may includesubstituting a defective element of the memory with a redundant element.The memory repair module may reallocate the redundant elements for eachrepair combination/set.

As mentioned, the number of repair combinations may relate to the numberof redundant elements. For example, if there are two redundant rows andtwo redundant columns for a square memory array, the number of repaircombinations may be determined according to: C₂⁴→(2+2)!/(2!×2!)=(1×2×3×4)/(1×2×1×2)=6. Therefore, 6 differentcombinations of repair substitutions may be used to repair the memory.In other words, for this example, there are optimally 6ways/combinations of substituting 4 redundant rows/columns for 4non-redundant rows/columns in response to memory failures. To furtherillustrate, if there are four redundant rows and four redundant columns,C₄ ⁸→(4+4)!/(4!×4!)=70. Therefore, there may be 70 differentcombinations that may be used to repair the memory.

The memory repair module may control soft repair operations to test eachsubstitution while forming the new memory map. The soft repairoperations may include simulating a hard repair operation by mapping aplurality of registers. The memory control module may read/write frommemory according to the soft repairs so that the memory repair modulemay determine that one of the sequences has successfully repaired thememory. If the memory is repairable, the memory repair module may thencontrol hard repair operations to permanently remap the memory accordingto the sequence that repairs the memory. In other words, the memoryrepair module may then blow fuses for a hard repair of the memory. Inthis manner, memory defects/failures may be repaired duringmanufacturing, after manufacturing, and/or after sale and use.

Referring now to FIG. 3, a system 100 for self-repair of memory 104 isshown. The memory 104 includes redundant memory elements 105 asdescribed above. The system 100 further includes a memory repair module110 and a memory control module 112.

The memory repair module 110 may control soft and hard repair operationswhen either or both the memory repair module 110 and the memory controlmodule 112 detects a failure. The memory repair module 110 controls afirst memory repair sub-circuit 113 for soft repair operations and asecond memory repair sub-circuit, which may be a fuse box 114, for hardrepair operations.

Alternatively, hard and soft repair operations may be included in asingle hybrid module. Further, some or all of the hard and soft repairoperations may be conducted through programmable reversible fuses, suchas flash based fuse circuits, that may be written to/blown multipletimes. For example, the memory repair module 110 may determine a repairnecessary in a soft repair operation using the reversible fuses and thenand then program the reversible fuses in a hard repair operation.

The memory repair sub-circuit 113 may set one or more registers (notshown) to, for example, 0 and 1, to cause appropriate remapped datapaths to be activated. The fuse box 114 may include fuse elements asdescribed in FIGS. 2A and 2B. The memory 104 may be integrated with anyor all of the memory repair module 110, the memory repair sub-circuit113, and the fuse box 114.

The memory control module 112 may invoke the memory repair module 110 torepair memory failures. Alternatively, the memory repair module 110 mayautomatically detect and repair the memory failures at any time duringand/or after manufacturing of the system 100. Therefore, external memoryrepair through, for example, automatic test equipment (ATE) may not berequired. The memory repair module 110 may execute detect and/or repairfunctions conditionally, at power-up, and/or when triggered by a user.

Referring now to FIG. 4, the memory repair module 110 may include memorycondition, testing control, hard repair command, soft repair command,and combination index sub-modules 122, 124, 126, 128, 129. The testingcontrol sub-module 124 may analyze data read from the memory 104 todetermine whether the data read from respective addresses in the memory104 matches the data originally written to those respective addresses.The testing control sub-module 124 may determine that a failure has beendetected in the memory 104 when data read from a particular address inthe memory 104 does not match the data written to that address. Thetesting control sub-module 124 may determine a soft repair map for thememory 104.

The soft repair sub-module 128 may control the memory repair sub-circuit113 based on the soft repair map. When the testing control sub-module124 determines that the memory 104 is repaired, the hard repairsub-module 126 may control the hard repair fuse box 114. The hard repairfuse box 114 may include non-programmable and/or programmable fuses,such as flash based fuse circuits.

The hard repair fuse box 114 may blow electrical fuses as necessary tore-associate memory addresses with the redundant memory elements 105based on the soft repair map. Alternatively, the hard repair fuse box114 may include anti-fuses that form connections as necessary tore-associate memory addresses with the redundant memory elements 105.Fuses would not need to be blown if the fuses used areprogrammable/reversible. The memory condition sub-module 122 generatesrepaired/not repairable signals that are received in the memory controlmodule 112. The combination index sub-module 129 includes operations fora plurality of solution combinations for repairing the memory 104. Eachof the combinations includes a sequence of repair operations and may beused by the testing control sub-module 124 for testing of the memory104.

For soft repair operations, when the memory control module 112 detects amemory failure, the memory repair module 110 may store the memoryfailure information in the memory repair sub-circuit 113. Further, thememory repair module 110 may locate an alternative memory location (i.e.a redundant memory element). The memory repair module 110 may then storethe redundant memory element information in the memory repairsub-circuit 113.

The information stored in the memory repair sub-circuit 113 may be lostwhen the system 100 is powered down. When the system 100 is subsequentlypowered on, the memory repair module 110 may again detect memoryfailures, locate redundant memory elements 105, and store theinformation in the memory repair sub-circuit 113. The memory repairmodule 110 may repeat this procedure at each power up. Alternatively,the memory repair sub-circuit 113 may retain the information by storingit in embedded memory (for example, flash memory) or by blowingreversible fuses.

Referring now to FIGS. 5, 6A, and 6B, as an illustrative example, memory104 includes an array of A rows and B columns (A×B cells) and may have Xredundant rows and Y redundant columns. The redundant rows and columnsmay be collectively referred to as redundant memory elements 105, as inFIG. 3. FIG. 6A includes eight rows 142-1, 142-2, . . . , and 142-8;eight columns 144-1, 144-2, . . . , and 144-8, two redundant rows 146-1,146-2, and two redundant columns 148-1, 148-2. The two redundant rows146-1, 146-2, and two redundant columns 148-1, 148-2 are merelyexemplary. There may be only six placement/solution combinations fordata within the four redundant elements 146-1, 146-2, 148-1, 148-2, asseen in the chart 150 of FIG. 5 and discussed above. The memory repairmodule 110 may use any or all of combinations 1-6 as illustrated forsoft repairs on the memory 104. Each of the combinations may include asequence for which substitutions will be made for the soft repairs. Asmentioned, the combination index sub-module 129 includes informationrelating to the solution combinations. An alternative repair sequencemay be used if the memory repair module 110 detects long term failure inthe memory 104 that may not be repaired by one of the combinations inFIG. 5. The alternative repair sequence may include replacing rows andcolumns in orders other than those illustrated in FIG. 5.

In FIGS. 6A and 6B, a first failure 160 may occur at the intersection ofrow 142-1 and column 144-2. The memory repair module 110 may set thememory repair sub-circuit 113 according to the first combination. Thememory repair module 110 may thus substitute redundant row 146-1 for row142-1 undergoing testing in response to the failure 160. In other words,when the memory 104 is written/read, cell 162 (at the intersection ofrow 146-1 and column 144-2) is used in place of the cell having thefailure 160. Because the entire row 142-1 containing the failure 160 isreplaced, other failures that may be present in the row 142-1 may alsobe repaired by this substitution operation.

Referring now to FIGS. 6C and 6D, the memory repair module 110 continuesto evaluate read data from the memory 104 until a second failure 166 isencountered at, for example, the intersection of row 142-2 and column144-5). The memory repair module 110 may substitute redundant row 146-2for row 142-2 in response to the second failure 166. Therefore, when thememory 104 is written/read, cell 168 (at the intersection of row 146-2and column 144-5) is used in place of the cell having the failure 166.

Referring now to FIGS. 6E and 6F, the memory repair module 110 continuesto evaluate read data from the memory 104 until a third failure 170 isencountered at, for example, the intersection of row 142-4 and column144-3). The memory repair module 110 may substitute a redundant column148-1 for the column 144-3 in response to the third failure 170.Therefore, when the memory 104 is written/read, cell 172 (at theintersection of row 142-4 and column 148-1) is used in place of the cellhaving the failure 170.

Referring now to FIGS. 6G and 6H, the memory repair module 110 continuesto evaluate read data from the memory 104 until a fourth failure 174 isencountered at, for example, the intersection of row 142-5 and column144-4). The memory repair module 110 may substitute a redundant column148-2 for the column 144-4 in response to the fourth failure 174.Therefore, when the memory 104 is written/read, cell 176 (at theintersection of row 142-5 and column 148-2) is used in place of the cellhaving the failure 174.

Referring now to FIG. 6I, the memory repair module 110 may determinethat the first combination of the chart 150 will not resolve failures inthe memory 104 based on discovery of a fifth failure 180. The memoryrepair module 110 may then initialize the memory repair database and usethe second combination that includes, according to the chart 150 of FIG.5, sequentially replacing a row, a column, a row, and a column.

Referring now to FIGS. 6J-6K, the memory repair module 110 may test thememory from the start of the array and replace failures according to thesecond combination. The memory repair module 110 may thus substituteredundant row 146-1 for row 142-1 undergoing testing in response to thefirst failure 160. In other words, when the memory 104 is written/read,cell 162 (at the intersection of row 146-1 and column 144-2) is used inplace of the cell having the failure 160.

Referring now to FIG. 6L, a second failure 166 may be detected at theintersection of row 142-2 and column 144-5. The memory repair module 110may replace the column 144-5 with a redundant column 148-1 so that thecell 187 at the intersection of row 142-2 and column 144-5 substitutesfor the cell including the failure 166. Further, for the third andfourth failures, the memory repair module 110 may replace a row and acolumn respectively. If third and/or fourth failures are not found, thememory repair module 110 may determine that the second combination isthe correct combination for repairing the memory.

The memory repair module 110 may determine that the second combinationof the chart 150 will not resolve failures in the memory 104 based ondiscovery of a fifth failure. The memory repair module 110 may theninitialize the memory repair sub-circuit 113 and use the thirdcombination. The memory repair module 110 may replace a row, a column, acolumn, and a row respectively, according to the chart 150 of FIG. 5.

The memory repair module 110 may likewise initialize the memory repairsub-circuit 113 and use combinations four through six in response tosuccessive failures found when redundant elements are utilized. Thememory repair module 110 may determine that the memory 104 is notrepairable if none of the combinations resolve all memory failures. Inthe present example, there may be six options for redundancy placement,thus, a maximum of only six runs may be made to test and repair thememory 104. In contrast, previous memory repair methods used heuristicrepair algorithms that were limited to single repair path and would nothave reset a memory repair sub-circuit 113 for subsequentcombinations/solutions.

The memory repair module 110 may generate a partial log for failuresoccurring during soft fixing operations and while testing. If repairoperations will not use all repair resources, the unused redundantrows/columns of the memory 104 may store information regarding the validredundant row/column, to be used during the functional life of thememory 104 during boot-up/power-up sequences. The memory repair module110 may repair the memory 104 during a power-up sequence with softrepair operations and interrupt the system or any start-up operations ifthe memory 104 is not fixed or not fixable.

Alternatively, the memory repair module 110 may only include onecombination. For example, memory 104 may include two memoryblanks/blocks and one redundant memory bank/block (instead of thepreviously discussed row/column solutions). The memory repair module 110may use the combination to soft repair a first failure in the memorybanks by replacing the respective memory bank including the failure. Ifsubsequent failures are found, the memory 104 may be determined to beunrepairable. Otherwise, the memory 104 is hard repaired according tothe combination. This example may also be extended for memory 104 thatincludes only redundant rows or only redundant columns where there maybe only one repair combination.

Referring now to FIG. 7, a flow diagram 188 illustrates steps foroperating a memory repair module. Control starts in step 189, and instep 190, the memory repair module 110 tests the memory 104 forfailures. In step 191, the memory repair module 110 detects a firstfailure. The memory repair module 110 then sequentially repairs thememory 104 according to repair combinations.

In step 192, the current repair combination, which may be a first,second, third, etc. repair combination (for example, combinations as inFIG. 5), is used to repair the failure. In other words, the combinationincludes a number of sequences for which redundant memory elementssubstitute for non-redundant memory elements. There may be one or morecombinations of substitutions.

In step 193, if the memory repair module 110 does not detect anotherfailure, the memory repair module 110 may assume the memory 104 isrepaired in step 194. If another failure is detected in step 193, thenin step 195, the memory repair module 110 determines whether allsubstitutions of redundant elements for the current combination havebeen made according to a repair substitution method (for example, one ormore rows of the chart of FIG. 5). If step 195 is false, the nextfailure is repaired according to the current combination in step 192,and control returns to step 193 where the next failure of the currentcombination is used. All options of a repair substitution method aretried in steps 192, 193, and 195 until the memory is repaired or failed.If failed, then a repair substitution method for a next combination istried in step 198.

If step 195 is true, and if all combinations have been tried in step197, and there still is a failure, then the memory repair module 110determines that the memory 104 is not repairable in step 199. If step197 is false, substitutions made for previous combinations may beinitialized. Further, testing may return to the start of the memory 104,and the substitution recipe of the next sequential combination may beused to repair the memory 104 in step 198.

Referring now to FIG. 8A, steps performed by the memory control module112 to implement a memory repair method 200 are shown. The memory repairmethod starts in step 226 where the memory control module 112reads/writes from the memory 104. The memory repair module 110 maymonitor the memory 104 for failures. If a first failure is found, atesting method starts according to the first combination found in chart150. If a failure is detected in step 228, the failure number from thechart 150 is incremented in step 230; and the memory 104 is repairedaccording to the failure number and the combination number in step 232.However, if the failure number is greater than the number of possiblesubstitutions (failure numbers) in the current combination in step 234,the combination number is incremented by one in step 236. If in step 238the combination number is greater than the total number of combinations,the array is found not repairable in step 240. Otherwise, in step 241,the memory array is repaired according to the current fail number andcombination number, and the memory control module 112 starts testingagain according to step 226.

Following step 232, testing continues in step 242. If no failure isdetected in step 228, and step 243 determines that testing operationsare not completed, testing continues in step 226. If step 243 determinestesting is completed, step 244 determines whether a hard repair isrequired. If step 244 is true, the memory 104 is hard repaired in step246. The memory 104 is tested in step 248. If the memory 104 passestesting in step 250, the memory 104 is determined to be repaired in step252. If step 250 is false, step 240 determines that the memory 104 isnot repairable. For example, a system fault flag may be generated tonotify the system and/or user that the system has a non-recoverablememory failure condition.

Referring now to FIG. 8B, steps performed by the memory control module112 to implement a memory repair method 260 using a hybrid repair moduleare shown. The memory repair method starts in step 262 where the memorycontrol module 112 reads/writes from the memory 104. The memory repairmodule 110 may monitor the memory 104 for failures. If a first failureis found, a testing method starts according to the first combinationfound in chart 150. If a failure is detected in step 264, the failurenumber from the chart 150 is incremented in step 266; and the memory 104is repaired according to the failure number and the combination numberin step 268. The memory repairs may be conducted through use ofreversible fuses. However, if the failure number is greater than thenumber of possible substitutions (failure numbers) in the currentcombination in step 270, the combination number is incremented by one instep 272. If in step 274 the combination number is greater than thetotal number of combinations, the array is found not repairable in step276. Otherwise, in step 268, the memory array is repaired according tothe current fail number and combination number.

Following step 268, testing continues in step 262. If no failure isdetected in step 264, and step 278 determines that testing operationsare not completed, testing continues in step 262. If step 278 determinestesting is completed, the memory 104 may be retested in step 280. If thememory 104 passes testing in step 282, the memory 104 is determined tobe repaired in step 284. If step 282 is false, step 276 determines thatthe memory 104 is not repairable.

The present disclosure can be applied to any memory technology thatimplements addressed memory locations. For example, the presentinvention can be applied to memory technologies including, but notlimited to, random access memory (RAM), dynamic random access memory(DRAM), static random access memory (SRAM), magnetic RAM (MRAM), readonly memory (ROM), programmable read only memory (PROM), electricallyprogrammable read only memory (EPROM), electrically erasableprogrammable read only memory (EEPROM), and/or flash memory, as well asany derivative of the above memory technologies, such as fast cycle RAM(FCRAM).

Referring now to FIGS. 9A-9G, various exemplary implementationsincorporating the teachings of the present disclosure are shown.Referring now to FIG. 9A, the teachings of the disclosure can beimplemented in nonvolatile memory of a hard disk drive (HDD) 300. TheHDD 300 includes a hard disk assembly (HDA) 301 and an HDD printedcircuit board (PCB) 302. The HDA 301 may include a magnetic medium 303,such as one or more platters that store data, and a read/write device304. The read/write device 304 may be arranged on an actuator arm 305and may read and write data on the magnetic medium 303. Additionally,the HDA 301 includes a spindle motor 306 that rotates the magneticmedium 303 and a voice-coil motor (VCM) 307 that actuates the actuatorarm 305. A preamplifier device 308 amplifies signals generated by theread/write device 304 during read operations and provides signals to theread/write device 304 during write operations.

The HDD PCB 302 includes a read/write channel module (hereinafter, “readchannel”) 309, a hard disk controller (HDC) module 310, a buffer 311,the nonvolatile memory 312, a processor 313, and a spindleNCM drivermodule 314. The read channel 309 processes data received from andtransmitted to the preamplifier device 308. The HDC module 310 controlscomponents of the HDA 301 and communicates with an external device (notshown) via an I/O interface 315. The external device may include acomputer, a multimedia device, a mobile computing device, etc. The I/Ointerface 315 may include wireline and/or wireless communication links.

The HDC module 310 may receive data from the HDA 301, the read channel309, the buffer 311, nonvolatile memory 312, the processor 313, thespindleNCM driver module 314, and/or the I/O interface 315. Theprocessor 313 may process the data, including encoding, decoding,filtering, and/or formatting. The processed data may be output to theHDA 301, the read channel 309, the buffer 311, nonvolatile memory 312,the processor 313, the spindle/VCM driver module 314, and/or the I/Ointerface 315.

The HDC module 310 may use the buffer 311 and/or nonvolatile memory 312to store data related to the control and operation of the HDD 300. Thebuffer 311 may include DRAM, SDRAM, etc. The nonvolatile memory 312 mayinclude flash memory (including NAND and NOR flash memory), phase changememory, magnetic RAM, or multi-state memory, in which each memory cellhas more than two states. The spindleNCM driver module 314 controls thespindle motor 306 and the VCM 307. The HDD PCB 302 includes a powersupply 316 that provides power to the components of the HDD 300.

Referring now to FIG. 9B, the teachings of the disclosure can beimplemented in nonvolatile memory of a DVD drive 318 or of a CD drive(not shown). The DVD drive 318 includes a DVD PCB 319 and a DVD assembly(DVDA) 320. The DVD PCB 319 includes a DVD control module 321, a buffer322, the nonvolatile memory 323, a processor 324, a spindle/FM (feedmotor) driver module 325, an analog front-end module 326, a writestrategy module 327, and a DSP module 328.

The DVD control module 321 controls components of the DVDA 320 andcommunicates with an external device (not shown) via an I/O interface329. The external device may include a computer, a multimedia device, amobile computing device, etc. The I/O interface 329 may include wirelineand/or wireless communication links.

The DVD control module 321 may receive data from the buffer 322,nonvolatile memory 323, the processor 324, the spindle/FM driver module325, the analog front-end module 326, the write strategy module 327, theDSP module 328, and/or the I/O interface 329. The processor 324 mayprocess the data, including encoding, decoding, filtering, and/orformatting. The DSP module 328 performs signal processing, such as videoand/or audio coding/decoding. The processed data may be output to thebuffer 322, nonvolatile memory 323, the processor 324, the spindle/FMdriver module 325, the analog front-end module 326, the write strategymodule 327, the DSP module 328, and/or the I/O interface 329.

The DVD control module 321 may use the buffer 322 and/or nonvolatilememory 323 to store data related to the control and operation of the DVDdrive 318. The buffer 322 may include DRAM, SDRAM, etc. The nonvolatilememory 323 may include flash memory (including NAND and NOR flashmemory), phase change memory, magnetic RAM, or multi-state memory, inwhich each memory cell has more than two states. The DVD PCB 319includes a power supply 330 that provides power to the components of theDVD drive 318.

The DVDA 320 may include a preamplifier device 331, a laser driver 332,and an optical device 333, which may be an optical read/write (ORW)device or an optical read-only (OR) device. A spindle motor 334 rotatesan optical storage medium 335, and a feed motor 336 actuates the opticaldevice 333 relative to the optical storage medium 335.

When reading data from the optical storage medium 335, the laser driverprovides a read power to the optical device 333. The optical device 333detects data from the optical storage medium 335, and transmits the datato the preamplifier device 331. The analog front-end module 326 receivesdata from the preamplifier device 331 and performs such functions asfiltering and AID conversion. To write to the optical storage medium335, the write strategy module 327 transmits power level and timing datato the laser driver 332. The laser driver 332 controls the opticaldevice 333 to write data to the optical storage medium 335.

Referring now to FIG. 9C, the teachings of the disclosure can beimplemented in memory of a high definition television (HDTV) 337. TheHDTV 337 includes an HDTV control module 338, a display 339, a powersupply 340, the memory 341, a storage device 342, a network interface343, and an external interface 345. If the network interface 343includes a wireless local area network interface, an antenna (not shown)may be included.

The HDTV 337 can receive input signals from the network interface 343and/or the external interface 345, which can send and receive data viacable, broadband Internet, and/or satellite. The HDTV control module 338may process the input signals, including encoding, decoding, filtering,and/or formatting, and generate output signals. The output signals maybe communicated to one or more of the display 339, memory 341, thestorage device 342, the network interface 343, and the externalinterface 345.

Memory 341 may include random access memory (RAM) and/or nonvolatilememory such as flash memory, phase change memory, or multi-state memory,in which each memory cell has more than two states. The storage device342 may include an optical storage drive, such as a DVD drive, and/or ahard disk drive (HDD). The HDTV control module 338 communicatesexternally via the network interface 343 and/or the external interface345. The power supply 340 provides power to the components of the HDTV337.

Referring now to FIG. 9D, the teachings of the disclosure may beimplemented in memory of a vehicle 346. The vehicle 346 may include avehicle control system 347, a power supply 348, the memory 349, astorage device 350, and a network interface 352. If the networkinterface 352 includes a wireless local area network interface, anantenna (not shown) may be included. The vehicle control system 347 maybe a powertrain control system, a body control system, an entertainmentcontrol system, an anti-lock braking system (ABS), a navigation system,a telematics system, a lane departure system, an adaptive cruise controlsystem, etc.

The vehicle control system 347 may communicate with one or more sensors354 and generate one or more output signals 356. The sensors 354 mayinclude temperature sensors, acceleration sensors, pressure sensors,rotational sensors, airflow sensors, etc. The output signals 356 maycontrol engine operating parameters, transmission operating parameters,suspension parameters, etc.

The power supply 348 provides power to the components of the vehicle346. The vehicle control system 347 may store data in memory 349 and/orthe storage device 350. Memory 349 may include random access memory(RAM) and/or nonvolatile memory such as flash memory, phase changememory, or multi-state memory, in which each memory cell has more thantwo states. The storage device 350 may include an optical storage drive,such as a DVD drive, and/or a hard disk drive (HDD). The vehicle controlsystem 347 may communicate externally using the network interface 352.

Referring now to FIG. 9E, the teachings of the disclosure can beimplemented in memory of a cellular phone 358. The cellular phone 358includes a phone control module 360, a power supply 362, the memory 364,a storage device 366, and a cellular network interface 367. The cellularphone 358 may include a network interface 368, a microphone 370, anaudio output 372 such as a speaker and/or output jack, a display 374,and a user input device 376 such as a keypad and/or pointing device. Ifthe network interface 368 includes a wireless local area networkinterface, an antenna (not shown) may be included.

The phone control module 360 may receive input signals from the cellularnetwork interface 367, the network interface 368, the microphone 370,and/or the user input device 376. The phone control module 360 mayprocess signals, including encoding, decoding, filtering, and/orformatting, and generate output signals. The output signals may becommunicated to one or more of memory 364, the storage device 366, thecellular network interface 367, the network interface 368, and the audiooutput 372.

Memory 364 may include random access memory (RAM) and/or nonvolatilememory such as flash memory, phase change memory, or multi-state memory,in which each memory cell has more than two states. The storage device366 may include an optical storage drive, such as a DVD drive, and/or ahard disk drive (HDD). The power supply 362 provides power to thecomponents of the cellular phone 358.

Referring now to FIG. 9F, the teachings of the disclosure can beimplemented in memory of a set top box 378. The set top box 378 includesa set top control module 380, a display 381, a power supply 382, thememory 383, a storage device 384, and a network interface 385. If thenetwork interface 385 includes a wireless local area network interface,an antenna (not shown) may be included.

The set top control module 380 may receive input signals from thenetwork interface 385 and an external interface 387, which can send andreceive data via cable, broadband Internet, and/or satellite. The settop control module 380 may process signals, including encoding,decoding, filtering, and/or formatting, and generate output signals. Theoutput signals may include audio and/or video signals in standard and/orhigh definition formats. The output signals may be communicated to thenetwork interface 385 and/or to the display 381. The display 381 mayinclude a television, a projector, and/or a monitor.

The power supply 382 provides power to the components of the set top box378. Memory 383 may include random access memory (RAM) and/ornonvolatile memory such as flash memory, phase change memory, ormulti-state memory, in which each memory cell has more than two states.The storage device 384 may include an optical storage drive, such as aDVD drive, and/or a hard disk drive (HDD).

Referring now to FIG. 9G, the teachings of the disclosure can beimplemented in memory of a mobile device 389. The mobile device 389 mayinclude a mobile device control module 390, a power supply 391, thememory 392, a storage device 393, a network interface 394, and anexternal interface 399. If the network interface 394 includes a wirelesslocal area network interface, an antenna (not shown) may be included.

The mobile device control module 390 may receive input signals from thenetwork interface 394 and/or the external interface 399. The externalinterface 399 may include USB, infrared, and/or Ethernet. The inputsignals may include compressed audio and/or video, and may be compliantwith the MP3 format. Additionally, the mobile device control module 390may receive input from a user input 396 such as a keypad, touchpad, orindividual buttons. The mobile device control module 390 may processinput signals, including encoding, decoding, filtering, and/orformatting, and generate output signals.

The mobile device control module 390 may output audio signals to anaudio output 397 and video signals to a display 398. The audio output397 may include a speaker and/or an output jack. The display 398 maypresent a graphical user interface, which may include menus, icons, etc.The power supply 391 provides power to the components of the mobiledevice 389. Memory 392 may include random access memory (RAM) and/ornonvolatile memory such as flash memory, phase change memory, ormulti-state memory, in which each memory cell has more than two states.The storage device 393 may include an optical storage drive, such as aDVD drive, and/or a hard disk drive (HDD). The mobile device may includea personal digital assistant, a media player, a laptop computer, agaming console, or other mobile computing device.

Those skilled in the art can now appreciate from the foregoingdescription that the broad teachings of the disclosure can beimplemented in a variety of forms. Therefore, while this disclosureincludes particular examples, the true scope of the disclosure shouldnot be so limited since other modifications will become apparent to theskilled practitioner upon a study of the drawings, the specification,and the following claims.

1. A memory system comprising: an array of memory cells comprisingredundant memory cells, wherein the redundant memory cells comprise atleast two of (i) a redundant row of memory cells and (ii) a redundantcolumn of memory cells; and a repair module configured to (i) identifyat least two of a row and a column of the array of memory cells havingnon-operational memory cells and (ii) substitute the at least two of therow and the column of the array of memory cells having non-operationalmemory cells with selected rows or columns of the redundant memory cellsbased on X predetermined sequences of substitutions, where X is aninteger greater than 1, wherein the repair module is configured todetect a failure in the array of memory cells that cannot be repairedusing the X predetermined sequences of substitutions, and use analternative repair sequence to repair the non-operational memory cellsbased on the detection of the failure.
 2. The memory system of claim 1,wherein the repair module is configured to detect the failure and thefailure is a long term failure, wherein the long term failure is definedas occurring subsequent to a predetermined period of time.
 3. The memorysystem of claim 1, wherein the a repair module, when substituting the atleast two of the row and the column of the array of memory cells havingthe non-operational memory cells with the selected rows or columns ofthe redundant memory cells based on the X predetermined sequences ofsubstitutions, replaces rows and columns of the array of memory cellswith selected rows or columns of the redundant memory cells in apredetermined order.
 4. The memory system of claim 1, wherein the repairmodule is configured to: replace at least two of a row and a column ofthe array of memory cells in a first predetermined order when performinga first one of the X predetermined sequences of substitutions; andreplace at least two of a row and a column of the array of memory cellsin a second predetermined order when performing a second one of the Xpredetermined sequences of substitutions, and wherein the secondpredetermined order is different than the first predetermined order. 5.The memory system of claim 1, wherein the repair module is configured toreplace one of (i) a row of the array of memory cells with a redundantrow of memory cells and (ii) a column of the array of memory cells witha redundant column of memory cells, until one of the X predeterminedsequences of substitutions repairs the array of memory cells.
 6. Thememory system of claim 1, wherein: responsively to a determination thatnone of the X predetermined sequences of substitutions repairs thenon-operational memory cells, the repair module uses the alternativerepair sequence to repair the non-operational memory cells based on thedetermination; and the alternative repair sequence is different than allof the X predetermined sequences of substitutions.
 7. The memory systemof claim 1, where the repair module is configured to replace rows andcolumns of the array of memory cells in an order that is different thanrow and column replacements orders of the X predetermined sequences ofsubstitutions when performing the alternative repair sequence.
 8. Thememory system of claim 1, wherein: the repair module is configured todetermine if the redundant memory cells are used to repair thenon-operational memory cells; and the repair module is configured tostore information regarding valid replacements of the non-operationalmemory cells in unused ones of the redundant memory cells.
 9. The memorysystem of claim 1, wherein: the repair module is configured to use thealternative repair sequence to repair the non-operational memory cellsusing a soft repair, wherein the soft repair is a reversible repair; andthe repair module performs a hard repair based on the soft repair,wherein the hard repair is an irreversible repair.
 10. A memory system,comprising: an array of memory cells comprising redundant memory cells,wherein the redundant memory cells comprise at least two of (i) aredundant row of memory cells and (ii) a redundant column of memorycells; and a repair module configured to (i) identify at least two of arow and a column of the array of memory cells having non-operationalmemory cells and (ii) substitute the at least two of the row and thecolumn of the array of memory cells having non-operational memory cellswith selected rows or columns of the redundant memory cells based on Xpredetermined sequences of substitutions, where X is an integer greaterthan 1, wherein the repair module is configured to determine if theredundant memory cells are used to repair the non-operational memorycells, and store information regarding valid replacements of thenon-operational memory cells in unused ones of the redundant memorycells.
 11. The memory system of claim 10, wherein the repair module isconfigured to determine which of ones of the X predetermined sequencesof substitutions repair the non-operational memory cells and store theones of the X predetermined sequences of substitutions as valid row andcolumn combinations in the unused ones of the redundant memory cells.12. The memory system of claim 10, wherein the repair module isconfigured to determine if all of the redundant memory cells are used torepair the non-operational memory cells and identify the unused ones ofthe redundant memory cells.
 13. The memory system of claim 10, whereinthe repair module is configured to store the information identifyingreplacements of the non-operational memory cells with ones of theredundant memory cells that result in a repair.
 14. The memory system ofclaim 10, wherein the repair module is configured to store theinformation identifying operational memory cells.
 15. The memory systemof claim 10, wherein the repair module repairs the non-operationalmemory cells during a boot-up process based on the information.
 16. Thememory system of claim 15, wherein the repair module is configured torepair the non-operational memory using a soft repair, wherein the softrepair is a reversible repair.
 17. The memory system of claim 16,wherein the repair module performs a hard repair based on the softrepair, wherein the hard repair is an irreversible repair.
 18. Thememory system of claim 10, wherein the repair module is configured toreplace rows and columns of the array of memory cells with selected onesof the redundant memory cells in a predetermined order when performingeach of the X predetermined sequences of substitutions.
 19. The memorysystem of claim 18, wherein the repair module is configured to: replaceat least two of a row and a column of the array of memory cells in afirst predetermined order when performing a first one of the Xpredetermined sequences of substitutions; and replace at least two of arow and a column of the array of memory cells in a second predeterminedorder when performing a second one of the X predetermined sequences ofsubstitutions, and wherein the second predetermined order is differentthan the first predetermined order.
 20. The memory system of claim 19,wherein the repair module is configured to replace one of (i) a row ofthe array of memory cells with a redundant row of memory cells and (ii)a column of the array of memory cells with a redundant column of memorycells, until one of the X predetermined sequences of substitutionsrepairs the array of memory cells.